Motivations: Contemporary computers employ multiple cores to provide better computing performance. Thus, the overall performance of a computer is determined by the speed of interconnects between the cores rather than the already fast core speed. In this chip-level interconnects with increasing importance, low energy consumption is one of key issues. Currently, about 50 % of energy in a processor is used for interconnects. Due to fundamental physical reasons, using light instead of electrons for interconnects at a distance longer than several hundreds of microns is advantageous to solve this energy consumption problem as well as other technological limitations of existing electrical interconnects
Candidates should have a master’s degree in engineering or a similar degree with an academic level equivalent to the master’s degree in engineering. The objectives of the project are to investigate/understand fundamental properties of the new laser structure and to experimentally demonstrate it. For these, this project comprises theory/modeling, device processing in clean room, and characterization. Thus, a successful applicant is preferably expected to have (1) basic understanding on electromagnetism, laser diodes, and optoelectronics, (2) clean room experiences
Study Subject(s):Hybrid III-V-on-Si Laser with Ultralow Energy Consumption
Course Level hD
Scholarship Provider: DTU
Scholarship can be taken at: Denmark
How to Apply:
To apply for this scholarship, you need to submit all the necessary information and document to be considered for the scholarship. Please take note of the application deadline and apply as soon as possible.
Scholarship Application Deadline: November 30, 2011
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